3D-modelling of any diamond shape by green laser to achieve a highly accurate result with minimal time and material loss.

SOLICO is an acronym for "Scanner, Optimizer and Laser Integrated Compact OGI" and it is a mean of combining a laser sawing/cutting process and a 3D mapping apparatus as a single unit. The sequence of actions when using SOLICO can be deduced from its name: measuring (scanner), optimizing the yield (optimizer) and simulating and executing laser process (laser).

SOLICO has 5 Axis ( X,Y,Z and 2 rotations) , a measuring device to create 3D mapping of rough stone (Scanner) and allocate the best polish shape plan (Optimizer) and executing laser 3D process (laser).

SOLICO integrated with OGI Rough software can able to cut rough stone to middle or to get best 50/50 pair rough stone or just table cut to make one single polish stone according to price list to get best value. SOLICO can cut any facetes, table cutting, blocking, bruting and create any shape 3D model.

SOLICO is advance compact laser system from Scanox Marking machine to abvle to cut/saw the stone. think what able you can do with marking device you just replace the laser marking with laser cutting all the other functions in Scanox marker remain in SOLICO.

Solution for CVD

Solico for CVD can do all the process to get final stone

Solico Process Sample

Solico is Laser processing offers many advantages compared with any other classical diamond processing:

3D diamond mapping capable of generating a map of a diamond
        and make best analyzing option.

Full OGI Rough software embed

High speed cutting

Rough diamond material is recuperated

Can cut Table facetting, girdeling (special for fancy shape),
         blocking, bruting and facetting of every shape

Possible to mark after 3D planing any facet, or girdle, on to the rough
        diamond like OGI Scanox Marker.

Take over existing marks on the diamond or any plan considering
         inclusions.

Fully automated system