Rough Diamond Planning
OGIRough analyzers provide the most innovative method for determining the optimal yield of a rough stone. Each one of the suggested models will measure your stone, analyze its dimensions and show you the best way to achieve the optimal completed diamond. It will present a 3D simulation of the analysis results, as well as comprehensive numerical information organized in charts and diagrams, intended to help you decide on the best way to process it.
The maximal weight and maximal value of the predicted polished diamonds are taken as the optimized criteria in accordance with the 4 C’s.
The predicted color is set by an operator or transferred from a rough color machine.
Our laser mapping technology software allows for optimal precision in revealing the stone's surface as well as detecting grooves, holes and any other concave area.
Our advanced laser marking software allows for the best options of marking, sawing and cutting as chosen by the operator.
The software is also able to automatically calculate the position and clarity grade of the inclusion as viewed by the OGI X-RAY system, even through a coated rough stone.
The OGIRough features will enable you to optimize your profits while increasing your diamond production.
Advanced Rough Planning
User-friendly and easy-to-learn with very little training necessary
Increases yield by exploiting maximum size from rough
Powerful algorithms are used to calculate millions of cutting options
Allocates round and all fancy shapes
Allocates its own special fancy shapes
New 3D technology mapping rotates in real video
Virtual cutting process plan (new OGI invention)
Quick parameter setting and proportion of finished stones according to international standards
Your own easy-to-make proportions - user definable
Supports new GIA cut database GIAFacetware
Integrated with OGI SAWCut laser sawing and cutting in order to minimize inaccuracy
Result information can be passed on to Local Area Network. Saves time and reduces overall cost
Viewer option to look at virtual reports of the plan and all the virtual processing cut
Label report printing used for controlling further cutting process
Excel format support
Multilingual software: English, Hebrew, Russian and Gujarati
Advanced Mapping (laser scanning required)
New algorithms to enable precise mapping of grooves and holes using advanced laser mapping.
Marking Features (laser marking required)
Latest Fiber-Laser Marking Technology with longer laser source
Superior black, uniformly aligned marking lines. Easy to view while
sawing & bruting
Marking options: light, medium, dark, provide flexibility to the user for marking spectrum darkness
According to the rough diamond type, a flexible laser marking provides null damage/risk to the diamond
Maintains marking margin which leads to safe, accurate & faster bruting
Intelligent function to keep out unmarked area where it matters the most
Marks sawing lines
Marks table line (for makeables it is very important)
Marks upper and lower girdle (stone after bruiting)
Marks crown and pavilion facet
Marks all the tops (saves a lot of money)
Marks culet
Marks defective parts to be removed
Marks shape model (help for fancy cut)
One key stroke can mark all options
Inclusions Technology (high resolution camera or X-RAY unit required)
Any visible inclusion, including Gleatz/ Piques (VS to I) can be considered.
Automatically calculates the position of the inclusion, hence, the clarity grade as viewed by the user.
Select any inclusion you want to consider in order to maximize your profit.
Automatic Sawing plan generated to facilitate and maximize your profit.
Value-based designed to accurately suggest the most profitable planning options in value recovery terms (different shapes, cut grades, color, inclusions, clarity grade and location).
Reflects the Firetrace out of the polish stone to discover whether the inclusion remained in after polish.
Calculates automatically the position of the inclusion and the clarity grade as viewed by the OGI X-RAY system, even through a coated rough stone.
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GIA Facetware - stone planning (Additional)
Multi position stone planning
Live video sawing
Brutting & Cutting
(under patent pending)
Laser Mapping
Laser Marking
Inclusions Mapping
OGI X-RAY Inclusions - 30.08.2006
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